Electronics Cooling
The heat loads of computer and other electronic systems continue to increase to staggering levels. BSST is actively developing advanced designs to reach a cooling capability that is twice that of standard thermoelectric cooling systems. Our technology and integration tools are designed to help those who are manufacturing, packaging, maintaining, and using computer and other electronics to achieve the most efficient cooling solution for their needs.
BSST's primary areas of focus are currently electronics enclosure cooling (vented or hermetic), server rack hotspot cooling, and liquid loop systems (especially those that require a below ambient temperature component). Depending upon the application, our designs utilize liquid or gas heat exchange fluids and sometimes a solid as in the removal of heat from a heat sink.
Liquid to Liquid
Liquid to Liquid Thermoelectric Device Using BSST's Patented Thermodynamic Cycle
Large scale heat transfer is most easily accomplished with liquid heat exchange fluids. This device uses liquid heat exchange fluids on both the heated and cooled sides. It makes use of the BSST high power density design concepts to reduce size, weight, and the amount of thermoelectric material needed, in this case by about a factor of six!
The device pictured here is part of an assembly about the size of a shoe box that contains 36 of these stacks and which is capable of pumping about 2½ kW. It is easily scalable from as little as 50 W to as much as 5 kW simply by changing the number of stacks or the number of elements within a stack.
This device employs the BSST thermal isolation thermodynamic cycle, resulting in high efficiency and the ability to achieve large temperature differences between the hot and cold sides.
Liquid to Air
500 Watt Liquid to Air Thermoelectric Device
BSST's uniquely designed Liquid to Air systems allow for significant cooling power in a variety of form factors. In a typical BSST configuration, ambient air enters the device and is instantly chilled to approximately 15 degrees Celsius. The air is then blown over electronic systems or critical components. The waste heat from the process is removed by the liquid loop (typically water, but other fluids can be used).
By using our patented thermodynamic cycle and our high power density configuration, BSST is able to provide high performance and low cost in the same devices.
Air to Air and Air to Solid
Amerigon, BSST's parent company, ships more than 1.2 million thermoelectric Air to Air devices to automobile seat manufacturers annually, making possible the cooled and heated car seats available on many car models. Building on this technology and manufacturing expertise, BSST has created Air to Air devices that provide electronic enclosure cooling at nearly double the efficiency of standard thermoelectric cooling devices.
Air-Solid (a) and Air-Air (b) Modules Using BSST's Patented Thermo-isolation